Photolithography transfers patterns onto silicon wafers using light, crucial for integrated circuits in microfabrication.

Involves cleaning wafers, applying photoresist, exposure to light, and developing to transfer patterns onto wafers.

Ultraviolet, deep UV, EUV, and X-ray lithography are used, with the wavelength impacting feature size.

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Silicon wafers are cleaned and prepared with an adhesion promoter for photoresist application.

Photoresist is applied onto wafers via spin coating, creating a uniform layer for pattern exposure.

Light exposure changes photoresist properties, allowing development to reveal the pattern.

Etching removes material from unprotected areas, crucial for pattern transfer in microfabrication.

Use of photomasks in projection systems to pattern wafers efficiently in semiconductor fabrication.

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EUV and laser technologies improve resolution for smaller feature sizes in integrated circuits.